Nexperia and Aurobay Join Forces on GaN and SiC Chips for Hybrid and EV Drivetrains

Power semiconductor maker Nexperia has struck an exploratory agreement with Aurobay Technologies covering wide-bandgap chips for hybrid and battery-electric vehicle platforms. Aurobay Technologies operates under Horse Powertrain, the Renault-Geely joint venture, and the two sides plan to pair Nexperia’s wide-bandgap component expertise with Aurobay’s drivetrain system integration capabilities.

At the heart of the arrangement are two compound semiconductor families: silicon carbide and gallium nitride. Both are seen as enablers of higher efficiency, lower switching losses and more compact power electronics than conventional silicon designs — traits that translate directly into longer range and faster charging for electrified models.

Neither company has disclosed a timeline or production commitments, describing the effort as an exploration of how these advanced devices could be deployed across future electrified and hybrid architectures. Further details on scope and milestones are expected as the collaboration develops.